Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Bergquist Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Manufacturer:

Manufacturer Part No:

SPK4-0.006-00-54

Enrgtech Part No:

ET10910868

Warranty:

Manufacturer

EGP 24.09

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Dimensions:

19.05 x 12.7mm

Thickness:

0.152mm

Length:

19.05mm

Width:

12.7mm

Thermal Conductivity:

0.9W/m·K

Material:

Thin Film Polyimide

Minimum Operating Temperature:

-60°C

Maximum Operating Temperature:

+180°C

Hardness:

Shore A 90

Material Trade Name:

Sil-Pad K4

Operating Temperature Range:

-60 → +180 °C