Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

Manufacturer:

Manufacturer Part No:

SPK6-0.006-00-104

Enrgtech Part No:

ET16827806

Warranty:

Manufacturer

EGP 53.22

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Dimensions:

25.4 x 19.05mm

Thickness:

0.152mm

Length:

25.4mm

Width:

19.05mm

Thermal Conductivity:

1.1W/m·K

Material:

Thin Film Polyimide

Minimum Operating Temperature:

-60°C

Maximum Operating Temperature:

+180°C

Hardness:

Shore A 90

Material Trade Name:

Sil-Pad K6

Operating Temperature Range:

-60 → +180 °C

0900766b813f31f7.pdf(datasheets)